Awarding College Credit for Industry Credentials
Findings from Ohio Community Colleges on Outreach and Intake Practices
ResearchPublished Aug 26, 2025
Many colleges award credit for prior learning (CPL) to individuals who have developed skills and knowledge that overlap with college coursework. The authors of this report provide guidance on promising outreach and intake practices for community college staff and leadership who oversee CPL. The authors’ findings from Ohio community colleges suggest the broad use of some promising approaches but also areas for improvement.
Findings from Ohio Community Colleges on Outreach and Intake Practices
ResearchPublished Aug 26, 2025
Many colleges award credit for prior learning (CPL) to individuals who have developed skills and knowledge that overlap with college coursework. Prior learning may come from military training, on-the-job learning, noncredit coursework, and preparation for industry credentials. CPL can help provide on-ramps into college for new learners.
Colleges vary widely in the types of CPL they offer and in their processes for assessing CPL. Some states, such as Ohio, offer statewide articulation agreements to improve consistency in how colleges award CPL and increase student access to CPL. In 2021, the Ohio Department of Higher Education began to develop statewide articulation agreements for industry credentials.
State policies can be an important first step to streamlining CPL. But college outreach and intake practices continue to vary, and these practices can play a critical role in shaping student access to CPL. The authors identified seven promising CPL outreach and intake practices based on the literature and advisory group input. They then assessed whether and how Ohio community colleges were using these promising practices. This report aims to offer useful guidance to community college staff and leadership overseeing CPL in Ohio and across the country.
This research was sponsored by the National Science Foundation and conducted by RAND Education and Labor.
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